UltraLite™,
an innovative design and plastics compound that reduces weight,
shipping and handling costs and waste in packaging throughout
the entire supply chain. It also combines multiple tray designs
into a single, new design without diminishing functionality.
Translation: fewer tray designs to order, use, store and
coordinate, which ultimately reduces your costs.
HOT™
(high operating temperature) trays to address the lead-free
solder initiative. The lead-free solder process involves
processing temperatures as high as 260℃, and HOT™ trays are
designed to withstand the higher process temperature and to
maintain dimensional stability.
Double-slope wall designs
to ensure accurate packaging placement.
A full range of innovative BGA tray designs
that accommodate traditional plastic over-mold and glob-top
devices as well as the latest CSP and small footprint BGA
packages.
A comprehensive set of package styles available
include: BGA, QFN, QFP, LQFP, PQFP, TSCP and PGA.
Design and tooling expertise to quickly address custom
requirements
for packaging not covered by our thousands of off-the-shelf mold
designs.